Evidence requests follow the suspected physical pathway, not a generic attachment checklist.
Technical depth that changes the next action.
CMP, patterning, and advanced packaging do not fail the same way. FabQED™ brings domain-specific mechanisms, evidence, containment logic, and communication boundaries into the response from the first customer signal.
Start with the context that can separate one cause from another.
Select a domain to see how FabQED™ reshapes the evidence ask, causal boundary, investigation path, and customer-safe response.
Read the surface as a coupled chemistry-mechanics system.
CMP excursions sit at the intersection of slurry chemistry, pad and conditioner state, film stack, polisher history, endpoint behavior, and the post-CMP clean route.
- Bind first
- wafer signature to tool, head, pad, conditioner, slurry, and clean-route genealogy
- Separate
- incoming material variation from consumable state, polisher state, and clean-path effects
- Prove with
- defect map, SEM/EDS, process trace, pad age, slurry data, and known-good splits
- scratch morphology
- residue or corrosion
- dishing and erosion
- removal-rate drift
- bound exposed lots
- rank physical pathways
- select the next evidence test
- hold customer claims to proof

Domain knowledge is useful when it improves the response.
Containment follows material, lot, tool, interface, route, and customer exposure.
Owners and due work change with the mechanism, proof gap, business risk, and response stage.
Customer updates remain clear about what is known, what is being tested, and what is approved.
The concept map supplies context. The operating record turns it into accountable work.
Semiconductor Atlas connects device, process, material, package, equipment, and reliability concepts. FabQED™ applies that context to evidence decisions, owner handoffs, customer commitments, and proof of closure without exposing the underlying knowledge substrate.