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Semiconductor reasoning in context

Follow the evidence.
See how the response comes together.

See complaint-to-closure and opportunity-to-revenue pipeline management in context: technical questions, accountable work and customer commitments.

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Illustrative case · Advanced packaging

A hybrid-bond particle excursion.

Follow the facts, competing hypotheses, structured DOE, accountable work, customer commitments and approved closure. Select a stage to inspect the reasoning and evidence.

Hybrid bonding · Cu / SiCNQualification exposureCustomer update dueEvidence decision open
Capture

Lock the exact signal

Hybrid-bond post-clean particles appear after a consumable-lot change.

SignalPost-clean particles at 4.8x baseline
ChangeFinal pad lot PC-74 entered the route
Scope42 wafers across 3 qualification lots
InterfaceCu / SiCN pre-bond surface preparation
Decision nowAcknowledge the signal without adding an unverified cause.
Connected response recordProof assembles as the work moves.
  1. CaptureCustomer, fab, lot, tool, symptom, and change context
  2. ContainExposure boundary, immediate controls, and customer clock
  3. InvestigateRanked causes, discriminating evidence, and open gaps
  4. ExecuteOwners, dependencies, due times, and decision receipts
  5. CloseSigned proof, recurrence link, and prevention follow-through
Response endpointHuman-approved, evidence-backed closure
Cross-cutting foundationCommunication runs through the entire response.

Rigor and speed come from keeping facts, decisions, owners, and commitments aligned.

Internal cross-functionalShared facts, owners, dependencies, and decision cadenceCustomer communicationReviewed facts, visible uncertainty, containment, and commitments
Intelligence foundationDomain and portfolio context shape every response decision.Semiconductor AtlasIndustry roadmaps, device-to-system technologies, domain depth, and evidence contextLab-to-FabPortfolio claims, qualification, roadmap fit, complaint exposure, and field learning
A closed ticket is not a proven closure.

FabQED™ makes the response measurable while work is still moving, not after the escalation has already become a postmortem.

Illustrative opportunity · Advanced packaging

From hybrid-bond surface preparation to production adoption.

A supplier's final-CMP slurry must earn its place in a fab's Cu / SiCN hybrid-bond process. Follow the customer requirements, structured DOE, interface and electrical evidence, qualification, award, ramp and realized revenue. Select a stage to explore the decisions and accountable work.

Need · 1 of 7

Translate the technology roadmap into a customer requirement.

A fab developing memory-on-logic stacking is evaluating a final-CMP slurry for wafer-to-wafer Cu / SiCN hybrid bonding. Start with the interface the customer must deliver.

Application boundary300 mm wafers; Cu pads in SiCN; customer-defined pitch and anneal budget.
Process challengeControl Cu recess, surface topography and cleanliness before bonding.
Material hypothesisBalance Cu / SiCN removal and residue cleanability while preserving throughput and limiting Cu corrosion.
Integration contextCMP → post-CMP clean → activation → queue → alignment, bonding and anneal.
Customer valueMore usable bonded wafers, a stable process window and a defensible cost per good stack.
Baseline to establishIncumbent consumable, wafer layout, tool route, defectivity and electrical performance.
Next decisionConfirm the target fab, application, technical sponsor and value hypothesis before committing the evaluation.
Connected opportunity recordTechnical proof stays linked to adoption.
Accountable lead
Account Manager
Evidence to connect
Customer application brief, critical requirements, incumbent baseline and program milestones.
  1. NeedApplication, process boundary and customer requirements
  2. EngageJoint evaluation plan, owners and dated commitments
  3. EvaluateControlled DOE and linked surface, bond and electrical evidence
  4. QualifyCustomer-accepted qualification scope and remaining conditions
  5. WinRecorded award, commercial commitments and launch handoff
  6. RampStable production supply and customer ramp acceptance
  7. RevenueRealized revenue, customer value and scoped expansion
Teal TeamTM coordination

Teal connects the customer roadmap with applications and product development, and brings missing requirements to the account owner.

Across every stageOne customer relationship. One accountable team.

Technical findings, customer feedback and commercial commitments stay connected throughout the opportunity.

Internal cross-functionalNamed owners, sample and tool dependencies, qualification gaps and supply commitmentsCustomer communicationJoint plans, reviewed findings, explicit limits and dated adoption decisions
Intelligence foundationRoadmap relevance becomes application-specific proof.Semiconductor Atlas3D integration, interface requirements, process interactions and technology-roadmap contextLab-to-FabMaterial claims, application fit, qualification boundaries, production performance and field learning
Technical context for this illustration

Finer-pitch hybrid bonding demands coordinated control of Cu / dielectric topography, surface cleanliness and alignment. This example applies those principles to a supplier evaluation; acceptance criteria belong to the customer application.

imec · Cu / SiCN process integrationimec · Hybrid-bond scaling roadmapimec · Scaling and reliability challenges

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